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Cost-effective compact batch reflow oven provides forced air convection heating technology with individual time and temperature controls to make profile set up quick and easy. The single zone GF-B-HT comes in a table-top configuration or with an optional stand.  It has a high temperature model capable of lead and lead-free soldering and 2 cooling stations making it the best reflow oven for the money.

This unique PCB shuttle system enables a higher throughput than standard batch ovens. Both sides of the oven have a cooling station. While one board is being processed, another board can be cooled and off-loaded, then a third board can be loaded and shuttled into the chamber for reflow.

• Low-cost reflow oven best for small batch runs and prototypes.
• Large window allows the operator to see the board throughout the entire reflow process
• Unique shuttle system enables higher throughput than standard batch ovens
• All stainless steel interior construction provides for years of useful life
• Nitrogen gas inerting option available
• Maximum board size is 12" x 12" (305mm x 305mm)
• Compatible with lead and lead-free soldering applications

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