LH-163w is a one component, demethanol type, room temperature moisture curing liquid sealing silica gel, which has the effect of sealing and bonding to electronic devices. It can be cured into elastomer with high hardness in a short time. After curing, it is closely bonded with its contact surface to facilitate sealing. This series of products have the advantages of fast surface drying, good insulation performance and easy use.

It can be widely used for bonding integrated circuits, microcomputer processors, high-power LEDs, memory modules, cache memories, sealed integrated chips, dc/ac converters, IGBTs and other power modules, semiconductors, relays, rectifiers and transformers of personal portable computers.

This product has good adhesion to metals including copper, aluminum, stainless steel, etc. the curing form is demethanol type, which does not cause corrosion to metal and non-metal surfaces.

Application area:

• LED
• Waterproof module
• Chip reinforcement
• Power module
• Automotive electronics
• telecommunication equipment
• Computer and its accessories

Technical Specifications uncured and cured

 All Performance data in this sheet was measured at 25 ℃ , relative humidity 55% condition, 7days after curing. We will not undertake the related responsibility for the data obtained from different test conditions or modified products

Curing time

The curing time is related to the ambient humidity / temperature and the depth of application,It is recommended that the depth of application be no more

than 5mm, and the rate of complete curing after surface drying is about 6.3mm every 7 days.

Using method：

• • Before gluing, wipe the surface of components with solvent and dry them
• • Wear protective glasses and gloves when using
• • Ventilation is required in the operating environment
  •  
  • Storage：
• Store away from light in a dry and cool place

The sealant cylinder with one component adhesive shall be placed horizontally to reduce sedimentation and separation