Why do components require low humidity storage?
McDry^TM Prevents Micro-Cracking of IC Packages During Reflow.

nhiệt độ cao liên quan đến pha hơi hoặc quá trình chảy lại làm cho hơi ẩm được hấp thụ mở rộng nhanh chóng. Hiện tượng nứt vi mô xảy ra ở gần 100% gói vi mạch có chứa hơi ẩm trong quá trình chỉnh nhiệt. Xảy ra trong thời gian dài, điều này có thể gây đứt dây và các vấn đề khác. Có thể ngăn ngừa hiện tượng nứt vi mô bằng cách sử dụng McDry ™ để bảo quản và hút ẩm IC cũng như đặt lại tuổi thọ sàn của các linh kiện theo IPC / JEDEC J-Std 033b.

Dehumidifying Principle

McDry™Electronic Drying Storage Cases provide low humidity storage without the use of nitrogen. Humidity is removed from the cabinets by use of a powerful zeolite desiccant. The desiccant is automatically recycled with a heating mechanism and does not require replacement. Moisture absorbed by the zeolite desiccant is vaporized and released outside of the cabinet. Memory shaped metal is utilized for fail proof ventilation. Forced air-flow convection system desiccates the entire cabinet without requiring the use of a fan for optimal dehumidification to take place.

Handling and Storage Guidelines of IC Packages 

In accordance with IPC/JEDEC J-STD-033B, IC packages that have been removed from MBBs must be kept under a condition of 5% or 10% relative humidity to prevent components from absorbing moisture. However, during the mounting process, opening and closing of dry cabinet storage doors may occur frequently in order to remove and replace moisture-sensitive devices. This will allow ambient air to flow into the cabinet and may raise the RH level. To limit this from occurring and to keep the relative humidity inside of the cabinet below 5% or 10% as specified, a consistent, ultra-low humidity storage level is recommended. Therefore, the storage guidelines utilizing the McDry™ cabinet corresponding to the repetition of opening and closing of doors.

Options

• Be able to install a socket for purging N2 gas

Specifications