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Category: Main/3. Electronics Equipments & Systems for embedded electronics design and PCB assembly/3.4 SMT Line System
| | | | | ◊ Đặc điểm chính: | | GDK Solder Paste Printer TSE
TSE SMT stencil printer, features simple and reliable structure, accurate positioning, convenient use, high precision, high stability and high cost performance
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Technical Parameters:
| PCB parameters |
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| Maximum board size(X x Y) |
450mm x 350mm |
| Minimum board size(Y x X) |
50mm x 50mm |
| PCB thickness |
0.4mm~6mm |
| Warpage |
Max. PCB ≤1%Diagonal |
| Maximum board weight |
6Kg |
| Board margin gap |
Configuration to 3mm |
| Maximum bottom gap |
20mm |
| Transfer speed |
1500mm/s(Max) |
| Transfer height from the ground |
900±40mm |
| Transfer orbit direction |
Left-Right,Right-Left,Left-Left,Right-Right |
| Transfer mode |
One stage orbit |
| PCB damping method |
Programmable flexible side pressure, (Optional: 1,Bottom integral suction cavity vacuum, 2.Multipoint partial vacuum at the bottom; 3. Edge locking and Substrate clamping) |
| Support method |
Magnetic thimble, Equal high block,Vacuum suction cavity; Special workpiece fixture |
| Printing parameters |
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| Printing head |
Linear motor type close loop printing head |
| Template frame size |
470mm x 370mm~737 mm x 737 mm |
| Maximum printing area(X x Y) |
450mm x 350mm |
| Squegee type |
Steel scraper/Glue scraper(Angel 45°/50°/60° matching the printing process) |
| Squegee length |
220mm~ 500mm |
| Squegee height |
65±1mm |
| Squegee thickness |
0.25mm Diamond-like carbon coating |
| Printing mode |
Single or double scraper printing |
| Demoulding length |
0.02 mm - 12 mm |
| Printing speed |
0 ~ 200 mm/s |
| Printing pressure |
0.5kg - 10Kg |
| Printing stroke |
±200 mm (From the center) |
| Image parameters |
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| Field of view |
6.4mm x 4.8mm |
| Platform adjustment range |
X.Y:±7.0mm,θ:±2.0° |
| Benchmark point type |
Standard shape benchmark point(SMEMA standard), solder pad/openings |
| Camera system |
Independent camera,upwards/downwards imaging vision system |
| Performance parameters |
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| Repetition precision of image calibration |
±10.0micron @6 σ,Cpk ≥ 2.0 |
| Repetition precision of printing |
±20.0micron @6 σ,Cpk ≥ 2.0 |
| Cycle time |
<7s |
| Product changeover |
<5mins |
| Equipment |
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| Power supply |
AC220V±10%,50/60HZ,15A |
| Air supply |
4~6Kg/cm2, 10.0 Diameter of the tube |
| Gas consumption |
About 5L/min |
| Operating system |
Windows XP |
| External dimension |
1140mm(L) x 1450mm(W) x 1480mm(H) (Without light,monitor and keyboard) |
| Machine weight |
Around 1000Kg |
| Temperature and humidity control module(optional) |
| Environment temperature |
23±3˚C |
| Relative humidity |
45-70%RH4 |
Standard Configuration:
Options Configuration:
| Item No. |
Function |
| 1 |
Automatic Add solder paste |
| 2 |
Paste Roll Height Monitor (aPRHM) |
| 3 |
Automatic Stencil plugging check |
| 4 |
SPI online function interface |
| 5 |
Internal temperature and humidity detection on the work area |
| 6 |
Automatic temperature and humidity control on the work area |
| 7 |
MES system seamless docking |
| 8 |
Squeegee pressure closed loop control feedback system |
| 9 |
Automatic dispensing function |
| 10 |
PCB Positioning Vacuum Cavity and Upper Press Function |
| 11 |
Window 10 system |
| 11 |
Upper Press Function |
| 12 |
PCB Size 525 mm * 350 mm |
| 13 |
PCB board support method Grid-Lock |
| 14 |
Support pins or support block detection sensor |
| 15 |
Stencil Detection function sensor |
| 16 |
Squeegee holder |
| 17 |
Magnetic squeegee |
| 18 |
System of adding solder paste from cartridge Semko 6 Oz |
| 19 |
Control - by touch screen monitor |
| 20 |
PC must have (SSD) |
| 21 |
Range of adjustment feets from 45 to 160 mm |
| 22 |
6.1 Software can save log-files
6. 2 Log-files contain data about all possible parameters of the equipment
6.3 Discreetness of data saving may be set up without limits
6.4 Export of log-files to Excel or Access
6.5 Alarm system in case of parameters are not correspond to preset parameters
6.6 Possibility of remote export of log files
6.7 For all parameters of the equipment there will be possibility of setting up of critical value of such parameters and further actions (means stoppage or further work with indication and information in separate log-file) with marks in log-files only in case of preset parameters will go beyond critical value. |
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UPS |
CÁC SẢN PHẨM KHÁC CÙNG NHÀ SẢN XUẤT / OTHER PRODUCTS FROM GDK |
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OUR GLOBAL PARTNERS
Minato, Leap, SMH-Tech, Xeltek, Elnec, Conitec, DediProg, Phyton, Hilosystems, Flash Support Group, PEmicro ||Rigol, Tonghui, Copper Mountain, Transcom, APM || Atten, Zhuomao, Puhui, Neoden, Ren Thang, Genitec, Edry, UDK ||
CONDITTION AND USING TERMS
TULA Solution Co., Ltd - Công ty TNHH Giải pháp TULA
Headquater: No. 173 Group 15, Dong Anh District, Hanoi 10000, Vietnam
Head-Office: No. 6 Lane 23, Đình Thôn street, Mỹ Đình ward, Nam Từ Liêm Dist., Hà Nội, Vietnam
Tel.: +84-24.39655633, Hotline: +84-912612693, E-mail: info (at) tula.vn |
TIẾNG VIỆT
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GDK Solder Paste Printer TSE: Máy in kem hàn tự động GDK TSE
