Category: Main/3. Electronics Equipments & Systems for embedded electronics design and PCB assembly/3.4 SMT Line System
| | | | | ◊ Đặc điểm chính: | | Our Competitive Edges of 3D SPI
• Programmable Structured Grating PMP Imaging Technology [PATENTED]
• High and low exposure technology; D-Lighting [PATENTED]
• RGB Tune Active 2D Lighting Source [PATENTED]
• Multi-Head Optical Source Technology [PATENTED]
• High-resolution lmage Processing System
• 5 Minutes AI Programming and One-Click Operation
• MES Intelligent Manufacturing Access Capability
• Z-axis Dynamic Compensation+Telecentric Lens for Static Compensation
• Mark Detection, Detection of Moving Bad Marks, and Closed-loop Control
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Competitive Edges - Programmable Structured Grating PMP Imaging Technology [PATENTED]
Phase modulation profilometry (PMP) is used to achieve 3D measurement of precision printed solder paste, which greatly improves the measurement accuracy while ensuring high-speed measurement.
Phase modulation profilometry (PMP), also known as phase shift profilometry (PSP), is a method based on sinusoidal structure grating projection, discrete phase shift to obtain multiple deformed light field images, and then calculate the phase distribution according to the multi-step phase shift method, and finally use triangulation and other geometric methods to obtain high-precision height, area, and volume measurement results.
Programmable Structured Grating PMP Imaging Technology
Programmable structured grating PMP imaging technology (PSLM PMP) uses German PSLM components with internationalcutting-edge technology. [Ten-year free warranty]
The object under inspection is sampled 8 times to ensure the high repeatability and accuracy of the equipment detection.
Programmable Structured Grating PMP Imaging Technology
Example of the PMP phase modulation profilometry technology principle
Competitive Edges - High and low exposure technology; D-Lighting [PATENTED]
The white light source used by conventional SPI will not affect the color of the PCB, but for black (Dark PCB) and high brightness PCB boards (ceramic PCB), since the reflection degree of these two PCBs to the structured grating is different from that of ordinary PCBs, darker images will be displayed during imaging. Data accuracy is affected and false alarms will increase significantly.
The D-Lighting technology used by S-Tech uses 4 photos in a group of 8 sampled photos, using high exposure mode and low exposure mode respectively. In the setting software, you can choose black, normal, and high brightness options. Perfectly handle PCB boards with different reflectivity and different colors.
RGB Tune Active 2D Lighting Source
Through RGB TUNE effective filtering of solder paste, white lines, and debris, false judgments of solder paste bridging can be perfectly resolved.
RGB Tune Active 2D Lighting Source
Through the photos taken by 2D light source, filter the R G B colors separately and capture the colors we need. Such as solder paste, pads, white wires, etc.
Competitive Edges- Multi-Head Optical Source Technology [PATENTED]
The unique Multi-Head optical source technology has obtained a national invention patent and uses 3 different colors of structured light to detect solder pastefrom different angles with an interval of 120°.
Flexible configuration to meet customer needs, optional single head, double head or multi-head.
Compared with the traditional white structured grating alternately taking pictures, Multi-Head can take pictures in multiple directions at the same time, which improves the detection speed.
| Technology Platform |
Large Platform Type B/C |
| Series |
GS |
| Model |
GS1200 |
| Measurement Principle |
3D white light PSLM PMP (Programmable Spatial Light Modulation, Phase Measurement Profilometry) |
| Measurements |
Volume, Area, Height, XY Offset, Shape |
| Detection of Non-Performing Types |
Missing print, Insufficient solder paste, Excessive solder paste, Bridging, Offset, Mal-shapes, Surface contamination, etc. |
| Camera Pixel |
5M(12M.19M,21M optional) |
| Lens Resolution |
3um/16um (4.5um - 20um optional) |
| XY Accuracy |
±15um |
| Repeatability |
≤1μm （4 Sigma）; volume/area：<1%（4 Sigma） |
| Gage R&R |
<10% |
| Inspection Speed |
0.35sec/FOV ~ 0.5sec/FOV (According to the actual configuration） |
| Quantity of Inspection Head |
1 (2.3 optional) |
| Mark-point Detection Time |
0.3sec/piece |
| Maximum Measuring Head |
±550um (±1200um optional) |
| Maximum Measuring Height of PCB Warp |
±5mm |
| Minimum Pad Spacing |
100μm (Pad height of 150 μm as reference); 80μm/100μm/150μm/200μm (Determined by actual configuration) |
| Minimum element |
01005（03015/008004 optional） |
| Maximum Loading PCB Size(X*Y) |
1200x650（GS1200） |
| Conveyor Setup |
Front orbit (Back orbit optional) |
| PCB Transfer Direction |
Left to right or Right to left |
| Conveyor Width Adjustment |
Manual & Automatic |
| Engineering Statistics |
Histogram；Xbar-R Chart；Xbar-S Chart；CP&CPK；%Gage Repartability Data；SPI Daily/Weekly/Monthly Reports |
| Gerber & CAD Data Import |
Support Gerber format (274x，274d), Manual teaching model；CAD X/Y，Part No.，Package Type input |
| Operating System Support |
Windows 10 loT Enterprise (64 bit) |
| Equipment Dimension and Weight |
W1730xD1420xH1530mm, 1630Kg(GS1200） |
| Optional |
One person controls more machines, Network SPC (Software only), 1D/2D Barcode scanner, Offline programming software, UPS continuous power supply |
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GS1200: 3D SPI (Inline - SMT & Mini-LED) - Máy kiểm tra kem hàn 3D tự động
