INTRODUCTION

Optical System

Imaging Method	Dynamic Imaging or Stop-and-Go on select configurations
Top Camera	4 or 9 or 12 Mpix high speed color camera (factory setting)
Angle Camera	N/A
Imaging Resolution	6 µm, 10 µm, 15 µm (factory setting)
Lighting	Multi-phase RGB+W LED
3D Technology	N/A
Max. 3D Range	N/A

Inspection Performance

Imaging Speed

4 Mpix@ 10 µm Dynamic Imaging: 60 cm²/sec 4 Mpix@ 15 µm Dynamic Imaging: 120 cm²/sec 9 Mpix@ 10 µm Dynamic Imaging: 72 cm²/sec 12 Mpix@ 6 µm Dynamic Imaging: 40 cm²/sec 4 Mpix@ 10 µm Stop-and-Go: 4.5 FOV/sec 4 Mpix@ 15 µm Stop-and-Go: 4.5 FOV/sec

Motion Table & Control

X-Axis Control	Ballscrew + AC-servo controller
Y-Axis Control	Ballscrew + AC-servo controller
Z-Axis Control	N/A
X-Y Axis Resolution	1 µm

Board Handling

Max PCB Size	TR7700 SII Plus@ 10 µm, 15 µm: 510 x 460 mm TR7700 SII Plus@ 6 µm: 400 x 400 mm TR7700 SII Plus DL@ 10 µm, 15 µm: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane TR7700 SII Plus DL@ 6 µm: 400 x 310 mm x 2 lanes, 400 x 400 mm x 1 lane
PCB Thickness	0.6-5 mm
Max PCB Weight	3 kg
Top Clearance	10 µm, 15 µm: 25 mm [48 mm optional◎※] 6 µm: 25 mm ◎The air blow module does not apply to this option ※This option is only available for 4 Mpix camera.
Bottom Clearance	10 µm, 15 µm: 40 mm [100 mm optional] 6 µm: 40 mm
Edge Clearance	3 mm [5 mm optional]
Conveyor	Inline Height: 880 – 920 mm * SMEMA Compatible

Inspection Functions

Component	Missing Tombstoning Billboarding Polarity Rotation Shift Wrong Marking (OCV) Defective Upside Down Extra Component Foreign Material
Solder	Excess Solder Insufficient Solder Bridging Through-hole Pins Lifted Lead Golden Finger Scratch/Contamination

Dimensions

WxDxH	TR7700 SII Plus: 1000 x 1400 x 1650 mm TR7700 SII Plus DL: 1000 x 1500 x 1650 mm Note: not including signal tower, signal tower height 520 mm
Weight	TR7700 SII Plus: 600 kg TR7700 SII Plus DL: 650 kg

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