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 SẢN PHẨM
 Máy nạp rom, Jig test
» Máy nạp rom đa năng
» Máy nạp Gang đa năng
» Máy nạp rom on-board
» Máy nạp chuyên biệt
» Hệ thống nạp tự động
» Phụ kiện đế nạp socket
»Xoá Rom, kiểm tra IC
» Sao chép ổ cứng, thẻ nhớ
»Jig test ICT/FCT/DIP-pallet
 Đo lường và kiểm tra
» Dao động ký oscilloscope
» Thiết bị viễn thông, RF
» Bộ thu thập dữ liệu
» Đồng hồ vạn năng số
» Máy phát xung, đếm tần
» Máy đo LCR, linh kiện
» Bộ đổi nguồn, tải điện tử
» Kit đào tạo, thực hành
 Các công cụ sản xuất
» Máy khò, mỏ hàn thiếc
» Tủ sấy, tủ môi trường
» Dây chuyền SMT Line
» Thiết bị sản xuất PCBA
 Thiết bị, công cụ khác
» Thiết bị Automotive
» Đo lực, cơ điện khác
» Thiết bị quang học
 Linh phụ kiện Điện tử
» Vi điều khiển họ 8051
» Nuvoton ARM Cortex-M
» Nuvoton ARM7/9 Soc
» Chip phát nhạc, audio
» Wireless RF IC, Tools
» Vật tư hàn, rửa mạch
 e-Shop thiết bị, vật tư
 Số lượt truy cập

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lượt xem, tính từ 20/12/2006
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OUR PARTNERS
(Products Line-Card)



Flash Support Group

PEmicro

Power Supply

Shenzhen KESD Technology Co.,Ltd.



Car and Consumer IC Solutions Provider


  

Danh mục nội dung: Chuyên mục chính/3. Hệ thống, công cụ và thiết bị phát triển sản xuất điện tử/3.4. Hệ thống dây chuyền sản xuất SMT (SMT Line system)


      
  Full Automatic Printer MXE PLUS: Máy in kem hàn tự đông MXE PLUS
  Part#: GDK MXE PLUS
  Ghi chú: Máy in kem hàn tự động
  Nhãn hiệu: GDK (Trung Quốc)
  Bảo hành: 12 tháng.
  [ Tài liệu Datasheet ]   [ Báo giá Quotation sheet ]   [ Shopping Shopping now ]   [ Views: 1754 ]   2023-10-18
 ◊ Đặc điểm chính:

Product Overview:
Easy to learn and use
High precision and high stability
With CE Certificate/ Award Certificate/ Software work Certificate/ Software ework Certificat/ Certificate of Authorization.


 ◊ Mô tả chi tiết:

Technical Parameters:

PCB parameters
Maximum board size(X x Y)

530mm x 510mm

Minimum board size(X x Y) 50mm x 50mm
PCB thickness 0.4mm~6mm
Warpage ≤1%Diagonal
Maximum board weight 5Kg
Board margin gap Configuration to 3mm
Maximum bottom gap 20mm
Transfer speed 1500mm/s(Max)
Transfer height from the ground 900±40mm
Transfer orbit direction Left-Right,Right-Left,Left-Left,Right-Right
Transfer mode

One stage Conveyor

PCB damping method

Automatic adjustment of PCB thickness + Programmable elastic side clamp (Option:1.Edge locking base plate

pressing;2.Bottom integral cavity vacuum;3.Bottom multi-point local vacuum)

Support method Magnetic thimble,  Equal high block,etc.(Optional:1.Vacuum Chamber;2.Special workpiece fixture)
Printing parameters
Printing head Floating intelligent printing head   (two independent direct connected motors)
Template frame size 470mm x 370mm~737 mm x   737 mm
Maximum printing area(X x Y)

530mm x 510mm

Squeegee type Steel scraper/Glue scraper(Angel   45°/50°/60° matching the printing process)
Squeegee length 300mm(optional with length of 200mm-550mm)
Squeegee height 65±1mm
Squeegee thickness 0.25mm Diamond-like carbon coating
Printing mode Single or double scraper printing
Demoulding length 0.02 mm - 12 mm
Printing speed 0 ~ 200 mm/s
Printing pressure 0.5kg - 10Kg
Printing stroke ±275 mm (From the center)
Cleaning   parameters
Cleaning mode

1.Programmable washer fluid injection system; 2. Dry, wet and vacuum modes

Length of cleaning and   wiping board

300mm+510mm

(optional with 400mm, 450mm, 500mm)
Image   parameters
Field of view 8mm x 6mm
Platform adjustment range X:±5.0mm,Y:±7.0mm,θ:±2.0°
Benchmark point type Standard shape benchmark  point (SMEMA standard), solder pad/openings
Camera system Independent   camera,upwards/downwards imaging vision system,geometric matching location
Performance parameters
Repetition precision of image calibration ±10.0μm @6 σ,Cpk ≥ 2.0
Repetition precision of printing ±15.0μm @6 σ,Cpk ≥ 2.0
Cycle time <7.5s(Exclude printing and   cleaning)
Product changeover <5min
Equipment
Power requirements AC220V±10%,50/60HZ,15A
Compressed air requirements 4~7Kg/cm2
Operating system Windows 7(Optional WIN10)
External dimension

1220mm(L) x1530mm(W) x 1520mm(H)

(Without light,monitor and keyboard)
Machine weight Around 1100Kg


Standard Configuration:

1. Accurate optical positioning system
Adjustable four light sources, light intensity is adjustable,light is uniform, and image acquisition is more perfect; Good identification (including uneven mark points), apply for tinning,copper plating, Gold plating,tin spraying,FPC and other types of PCB with different colors.

2. High efficiency and high adaptability stencil cleaning system
The new wiping system ensures full contact with the stencil and large vacuum suction,Ensure to eliminate the solder paste in the mesh, create an anti-static stick roller,and completely remove The solder paste adsorbed in the stencil and mesh truly realizes the effective automatic cleaning function.

3. Printing axis servo drive
Squeegee Y axis servo with screw drive, higher accuracy, more stable operation, extended service life provides a good printing control platform for customers.

4. Intelligent squeegee system
Intelligent programmable setting, two independent direct motors driven squeegee, built-in precise zero pressure detection system.

5. Simple and reliable PCB positioning system
The platform height is automatically calibrate d according to PCB thickness setting, which is intelligent, fast,simple and reliable in structure.

6. 2D solder paste printing quality inspection and SPC analysis
2D function for offset, less tin, leakage, tin connection and other printing problems can be quickly detected,the detection point arbitrary increase;The SPC software can analyze the samples collected by the machine CPK index ensures printing quality.


Available Options Configuration:

GDK High Precision Full Automatic Visual Solder Paste Printer SMT High Speed Flexo Screen Printer Mxe Plus


1. Automatic solder paste filling function
Regular and fixed point automatic addition of solder paste,to ensure the quality of solder paste and the amount of solder paste in the stencil. In order to ensure that the customer can carry out the quality of stable and continuous printing for a long time, improve productivity.
Can be real-time monitoring the roll diameter of the solder paste on screen trigger automatically add functionality

2. Detection function of solder paste margin of stencil
Real time detection of solder paste margin (thickness) on stencil,intelligent prompt for tin filling

3. Detection functionof Stencil plugging
By compensating the light source above the stencil, CCD is used to check the mesh in real time,so as to quickly detect and judge whether the stencil is blocked after cleaning,and carry out automatic cleaning, which is a supplement to the 2D detection of PCB.

4. Automatic dispensing function
According to different printing process requirements, PCB can be accurately dispensing tin,line drawing,filing and other functional operations after printing.

5. Squeegee pressure close-loop feedback control
Built in precise digital pressure sensor control system, through the squeegee pressure feedback system, it can accurately display the original pressure value of the squeegee,intelligently adjust the depth of the squeegee pressure,ensure the constant pressure value inthe printing process and obtain the highest process control, and realize the perfect printing of high-density and fine spacing devices.

6. Temperature and humidity control function
Automatic regulation and supervision of temperature and humidity in the printing press to ensure the stable physical characteristics of printing Materials.

7. Magnetic squeegee
Magnetic adsorption squeegee blade,instead of screw hole positioning mode, convenient and quick replacement.

8. Vacuum suction plate and upperpress function
It can automatically clamp PCB of various sizes and thicknesses to effectively overcome the deformation of the board,Make sure that the tin is evenly printed.

9. Support MES system seamless docking
It can scan the 1D code 2D code on the customer PCB and record the relevant information.which can be shared with the customer MES system. MES system uses 2D code,1D code, mobile IOT and other technologies to conduct scientific management on the warehouse material preparation and prevention, incoming material picking management, material loading and error prevention,production scheduling,quality traceability,Kanban control,etc. in the SMT production process. Through the optimization process to improve the production efficiency,improve product quality,shorten the production cycle, reduce the manufacturing cost,to achieve a comprehensive and scientific traceability management,to help enterprises quickly respond to market changes, improve the core competitiveness.

10. SPI online function interface
A closed-oop system is formed by connecting with SPI.After receiving feedback information of defective SPI printing, the machine will automatically adjust the offset according to SPI feedback. The XY offset can be adjusted automatically within 3PC.and clean the stencil, improve the printing quality and production efficiency,constitute a complete printing feedback system.
 


Other Available options Configuration:

Item No. Function
1 Paste Roll Height Monitor (aPRHM)
2 Internal temperature and humidity detection on the work area
3 Window 10 system
4 Upper Press Function
5 PCB Size 525 mm * 350 mm
6 PCB board support method Grid-Lock
7 Support pins or support block detection sensor
8 Squeegee holder
9 System of adding solder paste from cartridge Semko 6 Oz
10 Control - by touch screen monitor
11 PC must have (SSD)
12 Range of adjustment feets from 45 to 160 mm
13 6.1 Software can save log-files
6. 2 Log-files contain data about all possible parameters of the equipment
6.3 Discreetness of data saving may be set up without limits
6.4 Export of log-files to Excel or Access
6.5 Alarm system in case of parameters are not correspond to preset parameters
6.6 Possibility of remote export of log files
6.7 For all parameters of the equipment there will be possibility of setting up of critical value of such parameters and further actions (means stoppage or further work with indication and information in separate log-file) with marks in log-files only in case of preset parameters will go beyond critical value.
14 UPS





CÁC SẢN PHẨM KHÁC CÙNG NHÀ SẢN XUẤT / OTHER PRODUCTS FROM GDK
GDK Full Automatic SMD Stencil Printing Machine GDK 5M: Máy in kem hàn tự động GDK 5M
Full Automatic Printer MXE PLUS: Máy in kem hàn tự đông MXE PLUS
0.65m Automatic Solder Paste Stencil Printer PROSTAR
GDK SMT Automatic Solder Paste Stencil Printer NEO for mini-led: Máy in kem hàn tự động, Model NEO
2000mm Solder Paste Printer L2000: Máy in kem hàn tự động L2000
GDK Full Automatic Screen Printer GALAXY: Máy in kem hàn tự động GALAXY
HTGD (GDK) Original Factory Solder Paste Printer MX PLUS: Máy in kem hàn tự động MX PLUS
GDK Solder Paste Printer TSE: Máy in kem hàn tự động GDK TSE
Automatic Solder Paste Stencil Screen Printer XS: Máy in kem hàn tự động GDK XS
Semi Auto Solder Paste Printing Machine GDK SSP-600: Máy in kem hàn bán tự động



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