AMTECH LF4300 TF: Mỡ hàn cao cấp, chuyên cho sửa chữa điện tử 2020-06-29

Part#: LF4300-TF Ghi chú: Chất trợ hàn cho sửa chữa bo mạch Tài liệu    Báo giá Nhãn hiệu: Inventec Xuất xứ: Pháp/ France Điểm nhấn: Cao cấp, ít độc hại, không mầu (Hits: 1805) Đặc điểm: Amtech Flux products are ideal for reflowing and reballing BGA chips used in XBox360, PS3, laptops and GSM phones.     Touch-up and rework   Attachment of BGA spheres   Soldering Flip Chip components   Excellent wetting compatibility   Wide reflow window   Compatible with most board finishes Once you experience the superiority of the Amtech LF-4300-TF, you will never want to touch another flux. We have tested this product against all the top competitors and the Amtech is in a league of its own.  Try it and you will understand why we are so excited with this product.  It is simply the BEST. Tính năng riêng: Universal Water Washable Solder Flux (REL0) Package: Hộp (jar)

• REL0 flux classification - resin based, low activity water-washable tacky solder flux for professional/industrial use. Clear residue evaporates with hot air and doesn't short components. Universal - applicable for a syringe, stencil printing, rework, BGA sphere attachment and reballing using standard tin/lead alloys or lead-free metals. Halide-free (<0.05%).

• Industrial viscosity - 20-48 (Malcom @ 10 RPM/25°C (x103mPa/s)). Compatible with leaded and/or lead-free alloy systems (up to 250°C/500°F). Surface insulation resistant. No copper mirror breakthrough. Low electrochemical migration (<1 decade drop no-clean). REACH compliant, meets and exceeds the most rigorous requirements and military/avionics specifications.

• Activated residue is clear and non-corrosive - can be left on board for multiple SMT assemblies (manufacturer recommends cleaning all flux residues at all times to avoid board contamination or voltage leakage on circuits with high impedance, also non-activated residue may absorb moisture from the air and subsequently cause corrosion).

• Syringes are intended for industrial dispensing machines and use a piston stopper instead of a plunger - do not remove the piston as it delivers the best seal to prevent contact with air. Dispensing Kit is a third party add-on, not supplied by AMTECH. A plunger is to push on the piston and not necessary snuggly fitting AMTECH syringe, a plunger can be loose. Dispensing tip gauge (size) will be within 14-23 Ga and may differ from pictured.

• Genuine product made in the USA by Inventec Performance Chemicals. Distributed by AMTECH DIRECT - every original shipment will include AMTECH Soldering Profiles card.

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Recommended Profiles:

Profile-A was designed to serve as a starting point for process optimization

using Tacky Paste Flux. A cool down rateof (-) 2–4°C/second is ideal for the

formation of a fine grain structure without risking damage to thermally

sensitive components. This profile is recommended when soldering Sn63 or

Sn62 alloys.

Profile-B was designed to serve as a starting point for process optimization

using Tacky Paste Flux. A cool downrate of (-) 2 - 4°C/second is ideal for the

formation of a fine grain structure without risking damage to thermally sensitive

components. This profile is recommended when soldering Sn96.5/Ag3.0/Cu.5 or

Sn96.5/Ag3.5 alloys.

Hình ảnh, ứng dụng:

 

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Feedback:

Thanks for getting the flux out so quickly.  I had a play with both today and have

to say the 4300 flux is excellent.  I can use double the quantity I was able to use

before without any ball drift.   In theory there should be enough flux on there so I

only need to do the process once and not have to add more flux once the balls have

tacked themselves in place.  They smell a lot nicer than the other stuff I was

using.

Did half a dozen chips today with 100% success rate.

Thanks again.

Mark.

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